Solutions
Our Capabilities
PressCom’s focus is on
flexible manufacturing. We are structured and staffed to
handle:
- Pull and push scheduling
- Low to medium volume
- High mix (multiple part numbers)
- Quick incorporation of engineering design changes
Complex assemblies are never a problem at PressCom. Our
capabilities include:
- Electromagnetic interference (EMI) protection on
circuitry
- Surface-mount technology (fine pitch and ball grid
array)
- Through-hole mounting technology
- Processing of engineering change orders on multiple
assemblies
- RF designed assemblies requiring intricate “fencing”
installation
- Cabling attachment and assembly
In addition, PressCom follows IPC Class II and Class III
manufacturing standards, as established by the Association of
Connecting Electronic Industries.
Design and Prototyping
At PressCom, we
build a partnering relationship with our customers to
accomplish design and prototyping. We will work closely with
you on the design and prototyping of both systems and printed
circuit boards. Together, we can streamline designs to ensure
their manufacturability and testing.
Design
We partner with a company located in our
own building that designs single-sided, double-sided and
multi-layered printed circuit board layouts. We can
accommodate digital and analog layouts as well as flex circuit
layouts. And if you have special needs, we can design to your
custom specifications.
Prototype
When it comes to prototypes, PressCom
can assist you with single-sided, double-sided and multi-layer
fabrication.
Assembly and Production
PressCom
provides primary and secondary assembly of single- and
double-sided boards using surface mounting and mixed
technology (through hole/surface and fine pitch). We handle
consigned kit and/or procure/supply assembly. In addition, we
provide full functional testing.
Final Assembly and Testing
PressCom
carries out final assembly, product interfacing and electrical
testing of components such as:
- Enclosures
- Boxes
- Chassis
- Card cages
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